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 PRODUCT

CIS products are widely used in multi-function inkjet printers, multi-function laser printers, various scanners, photocopiers, digital photo frames, etc

 TECHNOLOGY

The core technology of CIS is the process development and application of COB (Chip On Board) in semiconductor wafer assembly.

 SERVICE

We always do our best to provide the most comprehensive service and satisfy customers’ need. Any design requirements can be customized.

Specifications  

No Model External Diameter Outside Demensions Winding resisitance Starding Voltage(V) Current(mA) Maximum self-starting cycle Max continuous pulse rate Pull IN(g.m) Pull Out(g.m) Size Speed
1 M0633 ∮6 22.6*∮6 50+/-8% 4.8 ≤200 1600pps 3000pps 2.0 2.0 A8,A6,A4(Letter),A3 Data rate:3~10MHa per channel
Image Processing :Black & White,& Color
2 M0635 11*∮6 40+/-10% 4.7 ≤200 1000pps 1000pps 1.3 1.5
3 M0652 19.8*∮6 15+/-7% 4.7 ≤450 2800pps 6000pps 1.8 2.1
4 M0670 11*∮6 40+/-10% 4.7 ≤200 3200pps 5000pps 1.6 1.9
5 M0684 8.5*∮6 40+/-10% 4.7 ≤180 3200pps 5000pps 1.8 1.9
6 M0686 8.8*∮6 40+/-10% 4.7 ≤180 3200pps 5000pps 2.0 2.3
7 M0813 ∮8 7.4*∮6 20.5+/-8% 4.7 ≤400 1250pps 3000pps 3.84 4.02